Wire Bond Process & Equipment Senior/Staff Engineer
On-siteSeremban, Negeri Sembilan, Malaysia
Job Summary
Lead the setup, qualification, and optimization of wire bonding equipment and processes, including CZ and DOE activities. Drive continuous process improvements to enhance yield, reliability, and throughput while troubleshooting equipment and process-related issues in a high-volume manufacturing environment. Perform disposition of non-conforming materials, implement corrective and preventive actions, and collaborate with cross-functional teams to support new product introductions. Analyze process data to identify trends and develop documentation such as FMEA, Control Plans, and SPC. Mentor junior engineers and ensure compliance with safety, quality, and environmental standards. Lead cost reduction and Manufacturing Value Add improvement projects.
Required Qualifications
- Bachelor's degree in Electrical/Electronic Engineering, Mechanical Engineering, Materials Science, or a related field
- Minimum 5-8 years of experience in wire bonding equipment and semiconductor process engineering
- Strong understanding of thermosonic and ultrasonic wire bonding techniques for Gold and Copper
- Solid Hands-on experience in ASM wire bonders, bonder programming, and process optimization
- Solid analytical and problem-solving skills, with experience using data to drive decisions
- Knowledge of semiconductor manufacturing standards, quality control, and reliability testing
- Statistical Knowledge/Hands-on in JMP, Minitab and/or other statistical tools
- Excellent communication and collaboration skills; ability to work across teams
Desired Qualifications
- Others wire type handling is a plus
- KNS Hands-on experience is a plus
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