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NXP SemiconductorsPosted 1 week ago

wire bond operator

On-siteKuala Lumpur, Kuala Lumpur, Malaysia

Full TimeEnterprise

Job Summary

Conduct wire bonding operations on semiconductor packages within automated production lines. Operate and monitor bonding equipment to ensure quality standards and yield rates. Perform routine maintenance checks and document production metrics. Adhere to strict safety protocols and quality control procedures. This role supports NXP's mission to deliver secure connectivity solutions for automotive, industrial, and IoT markets.

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