Thermal Mechanical Engineer
$100,000–$160,000 year
On-site · Milpitas, California, United States
Job Summary
Thermal Mechanical Engineer responsible for developing detailed FEA/CFD models of electro-optical sub-assemblies and system-level components to optimize quantum computer sub-systems. You will correlate simulations with experimental data, perform warpage and deformation analyses for multi-material assemblies, develop thermal cycling and mechanical fatigue models to predict long-term reliability, identify mechanical risk drivers and recommend design/material/process changes for robustness and manufacturability, analyze failures in electro-optical assemblies, support design FMEA and tolerance analyses, and create end-to-end simulation workflows to improve efficiency, accuracy, and repeatability. You will document results through technical reports and design reviews, leveraging tools such as ANSYS, COMSOL, and related platforms, with a focus on thermal conduction, convection, and solid mechanics within semiconductor packaging and silicon photonics contexts.
Required Qualifications
- M.Sc., or Ph.D in Mechanical Engineering, Electrical Engineering and Physics or related field
- 5+ years of hands-on modeling and simulation experience in the semiconductor industry
- Strong understanding of thermal conduction and convective heat transfer methodologies
- Deep knowledge of solid mechanics principles, including stress, strain, fatigue, creep, constitutive models of elastic, visco-plastic, and plastic materials
- Proficiency with simulation tools such as ANSYS (Mechanical, Icepak and Fluent), COMSOL, or equivalent, including nonlinear and transient analyses
- Working knowledge of lab-scale validation techniques
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