Thermal data Analysis Engineer

Thermal data Analysis Engineer sought to drive thermal design and analysis for GPU, AI accelerators, and data center products through simulation and hands-on experiments. Role includes development of packaging thermal solutions for GPUs and AI products, advanced packaging strategies (chiplets, multi-chip modules), co-design optimization (thermal, electrical, mechanical), and correlating experimental data with simulations to improve predictive models. Responsibilities include laboratory experiments to characterize thermal performance from advanced packaging to system level cooling, development of thermal metrology techniques (including two-phase cooling and microchannel heat spreaders), cross-functional collaboration with silicon design, packaging, and platform teams, and technical communication to stakeholders. Strong analytical/problem-solving skills, ability to work in cross-functional teams, and clear written/verbal communication are required. Preferred experience with semiconductor/GPU/HPC products, immersion/two-phase/microchannel cooling, thermal instrumentation and data acquisition, prototype development, and data processing. This role requires on-site presence in Phoenix, AZ.