technician Wire bond
On-siteKuala Lumpur, Kuala Lumpur, Malaysia
Job Summary
Conduct wire bonding operations using NXP Semiconductors equipment to enable secure connectivity solutions for embedded applications in automotive, industrial, IoT, mobile, and communication infrastructure markets. Operate within a team focused on delivering innovative solutions that advance a more sustainable future. Apply only if you are an external candidate; internal employees must use the internal career page. Note that NXP operates under a strict Preferred Supplier List (PSL) for all recruitment activities, and unsolicited submissions without prior written agreement will be considered free of obligations.
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