【Takasaki/Toyosu】Principle Package Engineer
HybridTakasaki, Gunma, Japan
Job Summary
Lead new Power MOSFET package development for TOLL/TOLG/TOLT variants, defining specifications and driving NPI and qualification activities to ensure AEC-Q101 compliance. Execute thermal analysis, resistance measurements, and reliability evaluations for power cycling, thermal cycling, and solder joint stress while conducting failure analysis and root cause investigations. Benchmark competitor technologies, develop simulation models in ANSYS Icepak and FloTHERM, and correlate results with measurements to optimize system-level performance. Support customer inquiries on thermal selection and reliability, generate technical documentation, and collaborate cross-functionally with design, product, and manufacturing teams. Participate in product definition reviews and technical decision-making to advance future package roadmaps.
Required Qualifications
- Thermal characterization and analysis
- Semiconductor package design fundamentals
- Reliability testing and qualification
- Failure analysis techniques
- Statistical data analysis
- PCB and thermal design knowledge
Desired Qualifications
- ANSYS Icepak
- ANSYS Mechanical
- FloTHERM
- Automotive semiconductor requirements
- AEC-Q101
- APQP/PPAP
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