Staff Process Engineer - Electroplating and CMP
$115,200–$153,600 year
On-site · Fremont, California, United States
Job Summary
Manufacturing engineer owning wet processes (Electroplating and CMP) in magnetic recording head wafer fabrication. Responsible for SPC of process, chemistries, and tool parameters (film composition & thickness, deposition/removal rates, pressure, temperature, chemical concentration, pH, etc.), and for optimizing process performance to ensure uniform deposition or removal of metal/dielectric materials while maintaining process margins. Conduct failure analysis for process/tool deviations affecting wafer quality. Participate in introducing new processes/materials into manufacturing and in qualifying new wet process equipment for capacity or technology advancement.
Required Qualifications
- Bachelor’s with 0-5+ years or Master’s with 0-3+ years of experience in related field, Ph.D preferred
- Minimum 0-3+ years of direct hands-on experience of electroplating and CMP processes
- Strong working knowledge of operating and maintaining electroplating and CMP tools
- Proficiency in AI-driven data analytics, smart manufacturing systems, and JMP
- Meticulous attention to detail; ability to work in a cleanroom; strong communication, collaboration, and analytical skills
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