Staff / Principal Wafer Bond Process Development Engineer
On-siteBoise, Idaho, United States
Job Summary
Develop and optimize wafer bonding processes to enable next-generation DRAM technologies, including direct bonding, hybrid bonding, and wafer thinning. Plan and execute design of experiments (DOEs) to improve process performance, product quality, and reliability. Drive yield improvement, cost reduction, and productivity initiatives using data-driven problem solving and advanced analytics. Evaluate and qualify new equipment, materials, and process technologies for development and manufacturing while collaborating with suppliers. Resolve complex manufacturing line challenges and implement process improvements across cross-functional teams. Utilize AI/ML and large language models to boost efficiency and maintain flawless operations.
Required Qualifications
- PhD with 3+ years
- Master's degree with 5+ years
- Bachelor's degree with 7+ years of relevant semiconductor industry experience
- 5+ years of experience developing and driving wafer bonding technologies, process integration, or related semiconductor manufacturing processes
- Hands-on experience with one or more of the following: direct bonding, hybrid bonding, wafer thinning, de-bonding, or other advanced bonding technologies
- Strong analytical and problem-solving skills with a demonstrated ability to lead complex technical challenges, drive innovation, and deliver process improvements through data-driven decisions
- Proven ability to work effectively across cross-functional teams while independently leading projects, influencing technical direction, and delivering results
- Experience developing and optimizing semiconductor processes to improve quality, reliability, yield, cost, and manufacturing readiness
Desired Qualifications
- Experience supporting DRAM, memory, or advanced semiconductor technology development
- Knowledge of process characterization, statistical analysis, DOE methodology, and root-cause investigation techniques
- Experience qualifying new equipment, materials, and process technologies for high-volume manufacturing
- Familiarity with supplier collaboration and technology transfer activities
- Experience using AI, machine learning, or large language models (LLMs) to improve engineering productivity and accelerate problem solving
- Strong written, verbal, and presentation communication skills
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