Staff Mechanical Design Engineer
$100,300–$150,200 year
On-site · Irvine, California, United States or Santa Clara, California, United States
Job Summary
Staff Mechanical Design Engineer needed to lead mechanical design and CAD development of high-performance semiconductor test infrastructures, including sockets, thermal heads, pedestals, and loading mechanisms. Responsibilities include tolerance analysis, FAU and CPC connector design, Silicon Photonics test infrastructure, compliant mechanisms, micro-fluid geometries, and robust, manufacturable designs from concept through high-volume deployment. Collaboration with thermal, packaging, test, and manufacturing teams; emphasis on precision tolerance management, fixture integration, alignment, and reliability under dynamic loading. Candidates should have strong 3D CAD proficiency (NX/SolidWorks/Creo), deep understanding of materials and CTE, experience with semiconductor test sockets/handlers/thermal heads, and a track record in DFМ and high-volume manufacturing readiness. Relevant leadership on cross-program infrastructure, prototype bring-up, lab validation, and production ramp is a plus.
Required Qualifications
- Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 3-5 years of related professional experience
- Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 2-3 years of experience
- equivalent professional experience in lieu of a formal degree
- Strong mechanical design experience in precision hardware, semiconductor test infrastructure, or high-tolerance assemblies
- Proficiency with 3D CAD tools (e.g., NX, SolidWorks, Creo, or equivalent)
- Solid understanding of materials, CTE mismatch, contact mechanics, and manufacturability constraints
- Experience working closely with thermal engineers and fluid-based cooling designs
- Ability to translate complex requirements into clear mechanical architectures and detailed designs
- Strong communication skills and comfort leading technical discussions across disciplines
- Experience with semiconductor test sockets, handlers, or thermal head assemblies
- Familiarity with high-volume manufacturing and DPPM-driven quality programs
- Exposure to fluid-integrated mechanical designs and precision machining limitations
- Experience supporting prototype bring-up, lab validation, and production ramp
- Prior leadership on cross-program platform or infrastructure designs
- Strong collaboration with manufacturing, reliability, and supply-chain teams
- Interface with external vendors on machining, surface finishing, coatings, and precision component fabrication
- Design for Manufacturability (DFM) optimization
- DFM of evaporator and fluid-integrated geometries
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