Staff Manufacturing Engineer, Reliability
On-site · Oregon, United States
Job Summary
Lead testing and validation of components for high-reliability applications by performing use case-based electrical and environmental stress tests; define and deploy new component technology platforms in a cross-functional team for new product applications through testing, simulation, and prototypes; qualify components for surface-mount electronic assembly manufacturing processes; drive stage-gate approvals, documentation, supplier quality interface, characterization, verification, and sustaining support in a highly automated manufacturing environment.
Required Qualifications
- B.Sc. or M.Sc. in Electrical Engineering, Applied Physics, Material Science, or equivalent physical science
- 3+ years of experience with chip-scale packaging, direct bump attach, copper pillar, and similar technologies
- Detailed knowledge of wafer-level packaging, wire bond, encapsulation, and chip attach, their materials, and processes
- Detailed knowledge of IC packaging failure modes and root cause analysis techniques
- Experience in high high-reliability electronics manufacturing environment
- Experience with quality systems, including technical writing of quality-relevant documentation
- Demonstrated ability to conceive, implement, and complete engineering projects and experiments on schedule
- Proficiency in standard office productivity software (Excel, Word, PowerPoint, etc.)
- Demonstrated ability to interface across multiple functions/organizations to drive closure on projects
- Demonstrated creativity with multiple examples of innovative solutions
- U.S. or EU Patents desirable
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