Staff Board Package Design Engineer
On-siteHyderabad, Telangana, India
Job Summary
Lead the board and package design team from block-level specification through final delivery for high-performance SOCs and MCUs. Drive the product plan independently, defining requirements, developing designs, and executing releases while fostering a creative, productive environment. Manage system clocking, power management, and debug activities, including SOC and peripheral interface specifications for high-speed protocols like PCIe and LPDDR. Oversee schematic, layout, and BOM generation using modern CAD tools, ensuring compliance with DFM, DFA, and advanced packaging technologies such as SiP and flip-chip. Utilize SI/PI simulation tools and scripting to automate design activities, delivering sustainable, power-efficient solutions for automotive, industrial, and IoT markets.
Required Qualifications
- MTech/BTech in EC/ EE/CS
- hardware engineering experience of 7 to 10 years
- Experience in Microcontroller and Microprocessor based complex design
- Experience in latest packaging Technologies and Manufacturing process
- Strong domain knowledge of system clocking
- Strong domain knowledge of system modes
- Strong domain knowledge of power management
- Strong domain knowledge of debug
- Highly experienced in board and package design from block level to final board and package delivery
- Ability to work independently with little supervision
- Must be a natural team player
- Must be able to drive the team to define, develop and execute the product plan from specification to release
Desired Qualifications
- Board level System architecture and design includes memory or communication interfaces
- SOC specifications and board level system specifications
- Development and design of SOC power supply, system power supply specifications, and PMIC specifications
- Interface specifications incorporating SOC-peripheral devices
- Experience with high-speed interface i.e. PCIe Gen3/4/5/, LPDDR 4/4x/5/5x, UFS, Ethernet, Flash memory
- Board level DC/AC simulations
- Schematic, Layout and BOM generation using modern CAD tools
- Experience with SoC Bring-up activities
- Familiarity with PCB technologies, DFM, DFA, materials, stackup design, assembly rules and manufacturing process
- Experience with tools: Ansys HFSS or Cadence SI/PI, or other SI/PI, Cadence APD (Allegro Package Designer) for IC package layout design, SIwave, HSPICE, ADS, Q3D
- Experience in IC packaging layout design, emphasizing advanced technologies like SiP (System-in-Package), flip-chip, and 3D packaging
- Comprehensive knowledge of packaging design aspects, encompassing power distribution, thermal control, and signal fidelity
- Thermal simulation experience
- Profound understanding of semiconductor manufacturing methodologies and packaging assembly processes
- Ability to automate the SI, PI and Packaging activities using scripting tools like Python, TCL
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