Sr.Staff / Staff Board Package Design Engineer
On-siteNoida, Uttar Pradesh, India
Job Summary
Lead board and package design from block level to final delivery, driving the team to define, develop, and execute the product plan from specification to release. Manage SOC specifications, system clocking, power management, and debug activities while developing PMIC and interface specifications for high-speed protocols like PCIe and LPDDR. Utilize modern CAD tools for schematic, layout, and BOM generation, including board-level DC/AC simulations and IC packaging layout for advanced technologies such as SiP and flip-chip. Automate SI, PI, and packaging activities using scripting tools to ensure signal fidelity and thermal control within semiconductor manufacturing processes.
Required Qualifications
- MTech/BTech in EC/ EE/CS
- hardware engineering experience of 7 to 15 years
- Experience in Microcontroller and Microprocessor based complex design
- Experience in latest packaging Technologies and Manufacturing process
- Strong domain knowledge of system clocking, system modes, power management, debug
- Highly experienced in board and package design from block level to final board and package delivery
- Ability to work independently with little supervision and drive the team to define, develop and execute the product plan from specification to release
- Must be a natural team player and strive towards fostering a highly creative and productive working environment
Desired Qualifications
- Board level System architecture and design includes memory or communication interfaces
- SOC specifications and board level system specifications
- Development and design of SOC power supply, system power supply specifications, and PMIC specifications
- Interface specifications incorporating SOC-peripheral devices
- Experience with high-speed interface i.e. PCIe Gen3/4/5/, LPDDR 4/4x/5/5x, UFS, Ethernet, Flash memory
- Board level DC/AC simulations
- Schematic, Layout and BOM generation using modern CAD tools
- Experience with SoC Bring-up activities
- Familiarity with PCB technologies, DFM, DFA, materials, stackup design, assembly rules and manufacturing process
- Experience with tools: Ansys HFSS or Cadence SI/PI, or other SI/PI, Cadence APD (Allegro Package Designer) for IC package layout design, SIwave, HSPICE, ADS, Q3D
- Experience in IC packaging layout design, emphasizing advanced technologies like SiP (System-in-Package), flip-chip, and 3D packaging
- Comprehensive knowledge of packaging design aspects, encompassing power distribution, thermal control, and signal fidelity
- Thermal simulation experience
- Profound understanding of semiconductor manufacturing methodologies and packaging assembly processes
- Ability to automate the SI, PI and Packaging activities using scripting tools like Python, TCL
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