Sr. Mechanical Engineer - Avionics Mechanical Packaging - TeraWave
$133,500–$203,263 year
On-site · Los Angeles, California, United States or Denver, Colorado, United States
Job Summary
Lead and drive the design, analysis, testing, and qualification of ruggedized avionics enclosures and assemblies for the TeraWave satellite system. Provide technical leadership within a cross-disciplinary mechanical team throughout the design cycle from concept through formal qualification and flight support. Collaborate with electrical engineers to integrate PCB interconnects and perform thermal/structural analyses; conduct design trade studies; create 3D CAD models and documentation; build prototypes and test fixtures; execute engineering tests and data reviews; mentor junior engineers; and communicate design concepts and results. Leverage experience in static/ modal/ random vibration and thermal analysis, GD&T (ASME Y14.5), and environment testing (vibration, shock, thermal cycling) to ensure high reliability in harsh environments. Desired familiarity with Creo, Ansys, Windchill, fatigue analysis, and aerospace packaging disciplines; experience in aerospace avionics systems and related environmental testing is highly desired.
Required Qualifications
- B.S. degree in mechanical or aerospace engineering
- 10+ years of experience designing ruggedized electronic enclosures or similar high-performance / high-reliability hardware
- Experience with static structural, modal, random vibration, and thermal analyses
- Proficiency with 3D CAD modeling (Creo preferred)
- Experience with FEA tools (Ansys preferred)
- Experience with GD&T (ASME Y14.5)
- Ability to conduct design reviews, communicate concepts and results
- Experience with environmental testing including vibration, shock, thermal cycling
- Experience in failure analysis and root-cause / corrective action
- Mentoring or leading junior engineers
- Ability to manage multiple projects and work self-directed
- Familiarity with aerospace, launch vehicle, or spacecraft avionics systems
- Knowledge of packaging disciplines related to avionics, power regulators, batteries, optics, sensors, RF systems
- Experience with Windchill, fatigue analysis, and fracture mechanics
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