Sr. Manager Packaging Engineering
HybridMarkham, Ontario, Canada
Job Summary
Lead end-to-end execution of multiple Data Center GPU and MI package design programs, ensuring schedule, quality, and cost targets are consistently met in fast-paced environments. Drive operational excellence by managing cross-functional teams across design, signal/power integrity, substrate vendors, and OSAT partners to deliver high-performance package solutions. Establish robust execution frameworks including milestone tracking, risk management, and readiness gates while championing AI/ML-enabled tools and automation to improve productivity. Mentor high-performing engineers across geographies, conduct performance reviews, and foster a culture of accountability aligned with engineering excellence. Interface with senior leadership to provide clear program status and mitigation strategies.
Required Qualifications
- B.S. or higher in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field
- Experience in semiconductor package design, with strong focus on high-performance or data center products
- Proven experience leading teams and executing multiple concurrent complex projects in fast-paced environments
- Strong understanding of package layout, high-speed design considerations, and multi-die integration
- Experience with AI/ML applications in engineering workflows (design automation, data analytics, optimization)
- Excellent leadership, communication, and stakeholder management skills
- Demonstrated ability to handle ambiguity, drive decisions, and deliver under pressure
- Experience working with OSATs, substrate vendors, and manufacturing partners
- Hands-on experience with industry tools such as Synopsys 3DICC, Cadence SiP / APD or equivalent
- Experience in Data Center GPU, HPC, or advanced packaging technologies (e.g., chiplets, 2.5D/3D integration)
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