SR ENGINEER, APTD PHOTO Process
On-site · Taichung, Taiwan, Taiwan
Job Summary
Drive HBM process development and yield improvement in PHOTO process; assist advanced package technology (chip stacking, 2.5D or 3D) research and development; support project on-site execution and act as technical consultant; troubleshoot a variety of complex problems and perform root-cause analysis; generate internal and external documentation for presentations and technical reports; engage in process development projects with cross-team interaction and provide expert contribution in materials characterization; coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore; provide recommendations for test structure and test vehicle design for material property evaluation; review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps; understand department and organizational goals to align daily tasks with Technology Development needs; ensure cross-team collaboration and alignment with project objectives.
Required Qualifications
- 3-7 years PHOTO experience in semiconductor related industry
- Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields
- Solid understanding of photolithography fundamentals - PR coating/Bake/exposure/develop flow
- Familier with Reticle Tapeout/CD control/overlay metrology concept
- Innovative with independent thinking
- Good team player with a high motivation
- Fluent communication in both English and Chinese
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