SR ENGINEER, APTD Dry Etch Process
On-site · Taichung, Taiwan, Taiwan
Job Summary
SR Engineer for APTD Dry Etch Process: drive HBM process development and yield improvement in DRY ETCH, assist advanced packaging research (chip stacking, 2.5D/3D), support on-site execution as technical consultant, troubleshoot complex issues, perform root cause analysis, and generate internal/external documentation. Engage in process development projects with cross-team collaboration, coordinate material characterization and testing for packaging development globally (US, Japan, Singapore), and provide recommendations for test structure and vehicle design for material property evaluation. Requires 4+ years in semiconductor industry, Master’s degree (PhD preferred) in Chemistry, Physics, Materials, or engineering-related fields, DRY ETCH experience with silicon/dielectric structures (TSV/Plasma Dicing a plus), innovative and independent thinker, and fluent English/Chinese.
Required Qualifications
- Master degree or higher in Chemistry, Physics, Materials, or engineering-related fields
- 4+ years in semiconductor industry
- DRY ETCH process experience with silicon or dielectric structures
- experience with TSV and Plasma Dicing a plus
- strong problem-solving and independent thinking
- team player with motivation
- English and Chinese fluent
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