Senior Thin Films Engineer
$133,800–$255,200 year
Hybrid · Phoenix, Arizona, United States or Hillsboro, Oregon, United States
Job Summary
Senior Thin Films Engineer responsible for driving process innovation in thin film deposition (CVD, ALD, PVD, epitaxy, thermal/plasma deposition, furnace, implant, anneal) across Intel's advanced semiconductor technologies, delivering manufacturability improvements from development to high-volume manufacturing. Lead cross-functional efforts with Technology Development, HVM, and external suppliers; own end-to-end manufacturing problem resolution; optimize equipment performance; synthesize complex technical data for strategic responses; influence technology roadmaps and customer requirements; stay current with industry trends and drive initiatives across multiple nodes (18A, 3, 12nm, and beyond). This role emphasizes technical leadership, collaboration, and hands-on execution to meet aggressive node targets while balancing safety, quality, yield, throughput, and cost.
Required Qualifications
- Master's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field
- 5+ years semiconductor industry experience with strong focus on thin film deposition processes
- Proven experience in process development, technical leadership, and manufacturing engineering
- Extensive background working with equipment suppliers (AMAT, LAM, ASM, TEL) on process optimization
- Comprehensive fab startup experience across manufacturing, quality, R&D, and supply chain functions
- Proficiency with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systems
- Experience with foundry business models and customer engagement requirements
- Strong communication and collaboration skills across cross-functional teams
- Experience driving clarity in complex technical situations and leading cross-functional initiatives
- Industry expertise in process development, materials science, and device physics
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