Senior Staff Signal & Power Integrity Engineer
$135,000–$183,000 year
On-siteIrvine, California, United States or Carlsbad, California, United States
Job Summary
Develop state-of-the-art packages and printed circuit boards for MaxLinear's next-generation products, focusing on RF/mm-wave modems, transceivers, and optical communications for data center and AI applications. Perform SI/PI simulations and optimization to ensure critical signals meet specifications, designing high-speed signal interfaces and power distribution networks for advanced SoC packages. Manage package development in collaboration with cross-functional teams including systems, IC design, and test characterization, while utilizing 2.5D and 3D simulation tools like ANSYS HFSS and Cadence Sigrity. Apply expertise in equalization techniques and noise optimization to drive efficient design guidelines for diverse product portfolios.
Required Qualifications
- Deep understanding of Electromagnetic fundamentals, transmission lines, and microwave theory
- Experience designing and simulating signal and power integrity solutions for high-speed system components (packages, PCB, connectors)
- Experience with high-speed channel simulations for SerDes and transient simulations for SI and PI
- Understanding of S-parameters, Smith Chart, and frequency domain analysis
- Proficiency in use of 2.5D and 3D simulation tools such as ANSYS HFSS, SIwave, Cadence Sigrity tools, or similar field solvers
- Expertise in time and frequency domain analysis using simulation tools like ADS, SPECTRE, etc.
- Hands-on experience with lab measurement equipment like Spectrum Analyzer, Vector Network Analyzer (VNA), Oscilloscopes, TDR
- Ability to manage package development in collaboration with cross functional teams including systems, IC design, IC physical layout, package/PCB layout, and test/characterization teams
- Self-motivated with ability to work effectively in both independent and team settings
- Strong communication, presentation, and documentation skills
- Excellent problem-solving skills and ability to excel in a fast-paced environment
- BS in Electrical Engineering or related + 7 years of experience, or MS + 5 years of experience, or Ph.D. + 2 years of experience
Desired Qualifications
- Experience with layout tools such as Cadence Allegro and APD
- Understanding of different IEEE and Optical standards to define design guidelines
- Experience with electro-optic integration on packages; co-packaging of DC-DC convertors, regulator, TIAs, and optical drivers and multi-chip package design
- Familiarity with IC design flows, floor-planning, IO ring design, on-chip decoupling, on-die EM/IR analysis
- Understanding of different TX/RX circuit designs and how system SI/PI impacts such circuits. Use this knowledge to drive the design of packages and PCBs
- Expertise in equalization techniques such as FIR, CTLE, DFE, FFE and different types of noise in the system and channels and how to optimize EQ settings to mitigate them
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