Senior / Principal Silicon Photonic Packaging & Process Engineer
$150,000–$250,000 year
On-siteNew York City, New York, United States
Job Summary
Lead development and scaling of precision opto-mechanical assembly processes for silicon photonic LiDAR modules, translating design concepts into repeatable production workflows. Own process definition and control for automated microlens alignment, die placement, and epoxy dispense systems to achieve sub-micron accuracy and high yield. Execute structured design of experiments to optimize yield, drive root cause corrective actions, and implement robotics and automation solutions for scalable, high-throughput manufacturing. Partner with contract manufacturers to qualify lines, train operators, and transfer complex processes from R&D to global production sites. Requires willingness to travel up to 25% domestically and internationally for process transfer and line qualification.
Required Qualifications
- BS or MS in Mechanical, Manufacturing, Photonics, or Electrical Engineering (or equivalent experience)
- 10+ years hands-on experience in semiconductor, photonics packaging, or precision opto-mechanical assembly environments
- CAD modeling and simulation
- SolidWorks preferred experience
- Deep familiarity with automated alignment and die-attach systems
- Strong understanding of adhesive dispense physics (viscosity, wetting, cure shrinkage) and related automation equipment
- Proficiency with DOE methods, SPC, and Minitab (or equivalent tools)
- Demonstrated experience working with automation solution providers and contract manufacturers to transfer and adapt prototype processes into high-volume production
- Excellent problem-solving skills and ability to collaborate across mechanical, optical, and test teams
- Willingness to travel up to 25% domestically and internationally
Desired Qualifications
- Experience with automated micro-optics or fiber alignment processes
- Experience in standard optics alignment and assembly for lens-to-PIC coupling
- Familiarity with standard micro-electronic assembly (die attach, wire bond, hermetic lid seal, PCBA/SMT)
- Understanding of cleanroom protocols and ESD control best practices
- Familiarity with ISO 9001 process control or automotive-style production quality systems
- Understanding of photonic packaging materials (epoxies, UV adhesives, underfills) and their environmental stability
- Background in precision metrology systems (e.g., digital microscopes, interferometers, or confocal profilers)
- Experience with Finite Element Analysis for both mechanical and thermal simulations
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