Senior Physical Failure Analysis Engineer
$144,000–$230,000 year
On-siteSanta Clara, California, United States
Job Summary
Conduct high-impact physical failure analysis investigations on advanced integrated circuits, deep learning processors, and system architectures to isolate root causes affecting product yield and reliability. Design and implement novel methodologies for precision de-processing, Focused Ion Beam sample preparation, and nanoscale diagnostics across die, package, component, and board levels. Lead root-cause investigations supporting multi-functional engineering teams with DOE evaluations, process node improvements, and customer requests. Optimize laboratory workflows to ensure accurate, reproducible determinations. Apply advanced optical and electron microscopy techniques to enable high-resolution electrical and physical diagnostics.
Required Qualifications
- Deep understanding of semiconductor IC fabrication, advanced packaging/assembly processes, and advanced failure analysis methodologies
- Proven proficiency in precision IC device sample preparation for targeted defect localization and physical root-cause analysis
- Hands-on expertise with advanced Optical and Electron microscopy (SEM/TEM), alongside related analytical inspection techniques
- Strong working knowledge of physical and electrical failure analysis across die, package, component, and board levels
- A B.S., M.S., or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, or a closely related field (or equivalent experience)
- At least 8 years of relevant, hands-on experience
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