Senior Packaging Technical Engineer - Hardware
$200,000–$322,000 year
Remote · New York City, New York, United States or US
Job Summary
In this Senior Packaging Technical Engineer position at NVIDIA, you will be responsible for defining and implementing the chip pad ring and substrate interconnect scheme while leading the package layout design process. Work collaboratively with large teams of engineers across various disciplines, including Circuit and Signal Integrity. Strong qualifications include a BSEE or equivalent, a minimum of 8 years in board/system design, and knowledge in package design. Effective communication and problem-solving skills, along with understanding of transmission line theory and power delivery, are essential. Programming skills in languages such as Perl, Python, Tcl are preferred.
Required Qualifications
- BSEE or equivalent experience
- Minimum of 8+ years in board/system design
- Good understanding of transmission line theory
- Power delivery and signal integrity knowledge
- Ability to work with minimal supervision
Desired Qualifications
- Experience with package design
- Programming and scripting skills in Perl, Python, Tcl
- Cadence Skill and EXCEL familiarity
Additional Requirements
- NVIDIA does not discriminate based on race, religion, gender, age, or other protected characteristics
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