Senior Member of Technical Staff (Advanced Packaging Pathfinding)
On-siteSingapore, Singapore
Singapore, SingaporeOn-siteFull TimeSenior LevelEnterprise
Full TimeSenior LevelEnterprise
Job Summary
Drive long-range pathfinding and early-stage technology development for N+2 and beyond advanced packaging architectures, leading hands-on feasibility studies for concepts like D2W, RDL, CoWoS, and heterogeneous integration. Execute experiments and simulations to validate novel integration approaches, perform deep technical trade-off assessments, and translate emerging concepts into scalable, differentiated capabilities. Collaborate with materials suppliers, equipment teams, and research partners to co-develop new technologies, while mentoring junior engineers and influencing cross-functional teams to align on technology direction.
Required Qualifications
- 10–15+ years of experience in semiconductor technology
- strong exposure to advanced packaging, process integration, or related domains
- Demonstrated experience in technology development, pathfinding, or exploratory R&D
- Strong understanding of advanced packaging technologies (RDL, TSV, CoWoS, hybrid bonding, etc.)
- Proven ability to solve complex technical problems and translate concepts into experimental validation
- Strong communication skills to articulate technical insights and business relevance
- Travel: Yes, 10% of the Time
- Relocation Eligible: Yes
Desired Qualifications
- Advanced degree (MS/PhD) in Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related field
- Experience in heterogeneous integration, chiplet architectures, or next-generation interconnect technologies
- Track record of innovation (patents, publications, or first-of-a-kind solutions)
- Familiarity with design–process co-optimization and system-level trade-offs
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