Senior Manager, Package PE, Product and System Engineering (High Bandwidth Memory)
On-site · Singapore, Singapore
Job Summary
Senior Manager, Package PE, Product and System Engineering (High Bandwidth Memory) leading cross-functional efforts in DPM reduction and yield improvement for HBM packaging; responsibilities include mentoring future leaders, project management, technical decision making, and collaboration across Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability to ship end products. Key duties include improving electrical test coverage and time0 DPM reduction, electrical failure analysis, root-cause analysis, PFA/EFA, and driving process improvements; seeks a seasoned engineering leader with strong leadership, communication, and problem-solving skills, capable of guiding complex, multi-disciplinary projects and developing talent in the semiconductor packaging domain.
Required Qualifications
- Bachelors/Masters of Electrical/Electronic/Mechanical Engineering
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