Senior Engineer - Design & Technology Evaluation (DTE) Group
HybridCork, Munster, Ireland
Job Summary
Lead complex IC analysis projects from problem definition through route selection, sample preparation, execution, and reporting. Perform hands-on techniques including x-ray, decapsulation, cross-sectioning, and SEM/TEM/EDX measurement to identify design and technology features. Act as technical interface to industry customers and research groups, scoping requests and delivering robust reports. Represent the group's IP-investigation capability to stakeholders and deputise for the Principal Engineer as required. Manage junior engineers and students while maintaining laboratory discipline, equipment care, and compliance with safety and quality standards. Support the development of the DTE capability roadmap, including equipment requirements, workflows, and strategic alignment with Tyndall's semiconductor and photonics programmes.
Required Qualifications
- A BE/BEng in Electrical or Electronic Engineering, or a MSc in Materials Science, Physics or a closely related discipline
- Strong knowledge of IC design and IC fabrication including CMOS, BiCMOS and BCDMOS technologies
- 10+ years of significant hands-on experience in semiconductor technology or physical failure analysis, including de-processing/delayering, sample preparation, microscopy and FIB/SEM/EDX/TEM-related workflows
- Proven ability to manage and support complex analysis projects, select appropriate analysis routes, interpret multi-technique evidence and produce clear, technically robust reports
- Proven ability to make recommendations on future potential engineering challenges and solutions that meet the needs of customers
- Excellent communication, documentation, safety, quality and customer-facing skills, with the ability to work effectively across multidisciplinary research, engineering and industry teams
- Valid driver's license
Desired Qualifications
- Demonstrable experience in at least one adjacent area such as photonics/optoelectronics, III-V/compound semiconductors, RF/MEMS, acoustic devices or advanced packaging
- Knowledge of one or more of ADCs, DACs, embedded memory, integrated LDMOS power or ESD protection structures
- Experience in IC circuit extraction, particularly of amplifiers and/or embedded memory
- Experience in analytical microprobing and ancillary characterisation equipment
- Experience in FIB circuit edit
- Experience in patent infringement analysis
- Experience mentoring, coaching or providing technical leadership to engineers, students or project teams
- Has an appetite for professional growth, with the potential and enthusiasm to take on increasing technical, strategic and management responsibility as the DTE Group develops
- Has maintained and developed collaboration that can contribute to funding of new projects
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