Senior Co-Packaged Optics Process Engineer
On-siteTaipei, Taiwan, Taiwan or Hsinchu, Taiwan, Taiwan
Job Summary
Ensure end-to-end assembly process readiness for CPO products at NV manufacturing partners by collaborating with RnD, PE, and Operations to guarantee robust manufacturing capabilities and reliability. Monitor yield analysis and drive continuous improvement initiatives for NPI production lines to optimize yield and efficiency while maintaining product quality through design and equipment stability enhancements. Provide onsite engineering support with technical ownership for process or equipment issues, utilizing hands-on debug experience and strong problem-solving abilities to resolve challenges. Participate in bringing new technologies from R&D to high-volume manufacturing, applying proficiency in SPC, 6 sigma, and failure analysis methodologies to reduce process cycle times.
Required Qualifications
- BS/MS degree in Mechanical Engineering, Optical Engineering, Material Science and/or related field
- 5+ years' experience in relevant fields – mass production, optical alignment process development, and data processing & analysis
- Hands-on debug experience with strong problem-solving ability
- Proficient in SPC, 6 sigma, quality control process
- good understanding of machine and process interactions
- Excellent communication/presentation skills in English
- Knowledge in Flip Chip Packaging / multi-chip module/ hybrid bonding / Optical Connector Assembly/ Optical Connector to chip attach
- Hands-on experience working with machines and optimize process recipes
- Knowledgeable in DFx, FMEA process, and failure analysis methodologies
- Know-how of yield analysis and process cycle time reduction methodology
- Experience working with OSAT in volume manufacturing environment
- a background with the semiconductor or optical communication industry
Desired Qualifications
- Ways to stand out in the crowd: Knowledge in Flip Chip Packaging / multi-chip module/ hybrid bonding / Optical Connector Assembly/ Optical Connector to chip attach
- Hands-on experience working with machines and optimize process recipes
- Knowledgeable in DFx, FMEA process, and failure analysis methodologies
- Know-how of yield analysis and process cycle time reduction methodology
- Experience working with OSAT in volume manufacturing environment as well as a background with the semiconductor or optical communication industry
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