Semiconductor Packaging Engineer
$110,385–$151,808 year
On-siteWilmington, Massachusetts, United States
Job Summary
Lead project-level semiconductor packaging design for MEMS sensors, driving design for manufacturability and reliability through process characterization and structured problem solving. Perform detailed package analysis using SolidWorks and ANSYS to evaluate mechanical and process performance, while partnering with quality and reliability teams to execute root cause analysis and yield improvement initiatives. Translate customer specifications into technical direction for internal teams and collaborate with OSAT partners to support rapid prototyping and vendor assembly readiness. Work across applications, manufacturing, and external vendors to reduce time to market and ensure robust, scalable packaging solutions from concept through manufacturing readiness.
Required Qualifications
- Strong experience in semiconductor packaging and manufacturing processes, with the ability to support package development from concept through release
- Strong understanding of substrates, adhesives, underfills, mold compounds, and interconnect materials used in semiconductor packaging
- Experience applying reliability and manufacturability principles to package design, qualification readiness, and process optimization
- Hands-on experience with 3D CAD and engineering analysis tools such as SolidWorks and ANSYS
- Demonstrated ability to apply DOE, PFMEA, SPC, 8D, RCA, and related methods to solve technical and manufacturing challenges
- Ability to work effectively across applications, manufacturing, quality, reliability, and external partner teams
- Strong communication skills with the ability to translate technical issues and requirements clearly across stakeholders
- Bachelor's or Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related technical field
- 5+ years of relevant experience in semiconductor packaging, process development, or manufacturing engineering
- Export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls
Desired Qualifications
- Experience supporting MEMS, sensor, or advanced package development
- Experience working with OSAT partners and external manufacturing vendors
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