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NXP SemiconductorsPosted 1 month ago

Semiconductor Package Competitive Analysis Intern

On-siteKuala Lumpur, Kuala Lumpur, Malaysia

Full TimeEntry LevelEnterprise

Job Summary

Support the Package Innovation team by performing structured data mining of competitor product releases, PCNs, teardown reports, and technology announcements. Develop insights on packaging trends, cost/performance positioning, and technology differentiation while conducting startup and emerging technology evaluations. Consolidate findings into clear, executive-ready reports and dashboards for leadership, and maintain competitive analysis databases and tracking frameworks. Gain foundational understanding of semiconductor assembly processes through exposure to ATKL manufacturing projects.

Required Qualifications

  • Degree candidate in Materials Science, Mechanical, Electrical Engineering, or related field
  • Strong analytical mindset with ability to synthesize large datasets into actionable insights
  • Proficient in Excel and PowerPoint
  • Data analysis or visualization experience
  • Strong communication skills with ability to clearly present findings

Desired Qualifications

  • Familiarity with AI tools and advanced search techniques for efficient data mining
  • Experience with PCNs, teardown reports, and technology announcements
  • Experience with startup and emerging technology evaluations relevant to advanced packaging
  • Experience with ATKL manufacturing projects

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