Semiconductor Assembly Process Development Engineer
On-site · Yonezawa, Yamagata, Japan
Job Summary
Semiconductor back-end technology development engineer responsible for development and evaluation of advanced packaging technologies (FCCSP, FCBGA), material/process development for assembly, packaging, and testing; support production line setup and mass production transition; drive process quality improvements and yield; requires 5+ years in semiconductor back-end technology development with hands-on process improvement experience; Bachelor’s degree in a technical field; Japanese business-level and English proficiency; desirable experience in AI/HPC packaging and ISO/IATF standards.
Required Qualifications
- Bachelor’s degree or above in a technical field such as Mechanical Engineering, Materials Science, Electronics, Chemistry, or a related discipline
- Minimum of 5 years of experience in technology development for semiconductor back-end processes (assembly and packaging)
- At least 5 years of experience in Molding, Strip Grinding, or Package Sawing
- Hands-on experience in process improvement, quality control, and equipment introduction/implementation
- Japanese business-level proficiency; TOEIC ~700 level English
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