半導体後工程アセンブリエンジニア

Operate wire bonding equipment and evaluate bonding processes to drive product launches and quality improvements for LSI delivered to major automotive and electronics manufacturers. Create and report evaluation reports based on process knowledge and condition assessments. Understand the full semiconductor post-processing workflow to support cross-departmental initiatives in equipment setup and productivity enhancement. Leverage experience in automation or AI to optimize operations. Work within a hybrid model, attending the office Tuesday through Thursday for collaboration, while contributing to sustainable solutions that make lives easier across automotive, industrial, and IoT sectors.