R&D Process Engineer

R&D Process Engineer responsible for designing and implementing packaging processes for new isolation products; perform Design of Experiments (DOE) to optimize processes and collaborate with IC designers, product engineers, manufacturing teams, support functions, and contract manufacturers to validate new device processes through R&D programs. Conduct process yield analysis and failure investigations; plan and execute programs to achieve cost reduction targets and drive breakthroughs in manufacturing yield, quality, and reliability. Requires hands-on experience in Die Attach, Wire Bonding, Encapsulation/Molding, Package Trim & Form, and Vision Inspection, with familiarity in mechanical leadframe design rules/tools and semiconductor physical failure analysis. Experience in IC packaging, high-voltage isolation requirements, materials, and processing techniques; NA/NP I projects leadership and potential advantage from leading products from verification through high-volume soft launch. Proficiency with Solidworks/Ansys, CAD and simulation tools; Broadcom emphasizes equal opportunity and inclusive hiring.