Quantum Assembly Engineer
On-site · Essex Junction, Vermont, United States
Job Summary
Lead development of cryogenic-compatible assembly processes for 2D, 2.5D, and 3D quantum packaging platforms. Define assembly schemes for flip-chip, micro-bump, superconducting bump attach; Die-to-wafer, wafer-to-wafer, and hybrid bonding. Ensure low-loss superconducting signal paths and mechanical integrity at cryogenic temperatures; own assembly integration flows from incoming wafer/die through package build; drive readiness for new technologies, tooling requirements, and cross-site collaborations. Focus on improving yield and throughput, reducing defects, conducting root-cause analysis for assembly-related issues, and supporting hardware bring-up and validation in cryogenic environments. Provide clear technical updates and data analysis to stakeholders and work with OSATs and suppliers to scale quantum packaging architectures within APPC.
Required Qualifications
- Master’s degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program
- MS degree with at least 10 years of prior related work experience
- In-depth knowledge of BEOL processes and integration, bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly
- Must have at least an overall 3.0 GPA and proven good academic standing
- Language Fluency - English (Written & Verbal)
- Travel - Up to 10%
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