Quantum Assembly Engineer
$118,000–$210,000 year
On-site · Essex Junction, Vermont, United States
Job Summary
Quantum Assembly Engineer responsible for leading development of cryogenic-compatible assembly processes for 2D/2.5D/3D quantum packaging, defining schemes for flip-chip, micro-bump, superconducting bump attach, and D2W/W2W/hybrid bonding; owning assembly integration from wafer/die to package, coordinating cross-functional interactions (bump/interconnect, TSV/interposer, substrate/package); enabling prototype builds and scalable assembly architectures for high-density qubit packaging, with emphasis on low-loss superconducting signal paths, cryogenic reliability, and RF/microwave performance; driving yield/throughput improvements, root-cause investigations, and collaboration across packaging, device, and external partners; contributing to IP generation, publications, and roadmap development; providing mentorship and leading new-hire training within the Advanced Packaging team.
Required Qualifications
- Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program
- MS degree with at least 10 years of prior related work experience
- In-depth knowledge of BEOL processes and integration, bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly
- Strong problem solving and technical troubleshooting skills including expertise in design of experiments
- Must have at least an overall 3.0 GPA and proven good academic standing
- Language Fluency - English (Written & Verbal)
- Travel - Up to 10%
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