Process Engineer, Chemical and Mechanical Polish (CMP)
$100,000–$140,000 year
On-siteTemecula, California, United States
Job Summary
Execute experiments and optimize Chemical and Mechanical Polish (CMP) processes during 24/7 Fab operations to improve production yields and manufacturing techniques. Conduct statistical analysis using Design of Experiments and Statistical Process Control to identify root causes of yield loss and monitor process health. Collaborate with Senior Engineers, Product Design, and Operations teams to develop new processes for Cu, Ta, W, and dielectric polishing while protecting customer and company IP. Assist Process Technicians in challenging steps, analyze metrology results to disposition lots, and write/run CMP recipes in cleanroom environments. Maintain operating specifications for production equipment and drive continuous improvement in a dynamic semiconductor manufacturing setting.
Required Qualifications
- Ph.D. or Master's Degree in Science with emphasis/majors in the fields of Electrical Engineering, Material & Science, Physics or Chemistry
- Processing experience in a lab or a fab in the areas of Chemical and Mechanical Polish, and post-polish wafer surface cleaning
- Processing experience with Cu plating
- Willingness to work a flexible schedule in support of 24x7 manufacturing
- Strong interpersonal and communication skills
- Ability to work with minimal supervision
- Basic understanding of algebraic concepts
- Good computer skills and familiarity with MS Office Word, Excel, and PowerPoint
- Good data extraction, analysis, and reporting skills
- Ability to troubleshoot basic problems and address root causes
- Must be able to work in a dynamic start-up environment
- Basic understanding of semiconductor processing
- Ability to understand all maintenance activity details required to ensure a healthy and repeatable process
- Ability to plan and prioritize activities, perform and monitor multiple overlapping tasks/operations to meet goals and timelines
- Requirement for strong ownership/responsiveness in a manufacturing environment, good data analysis/statistics skills and good oral/written communication skills
- Flexibility to work hands-on in the cleanroom, operate the tool when needed, write and run CMP recipes, inspect wafers under the microscope, and perform basic characterization related to CMP processing with particles / defects metrology, roughness metrology, and thickness / uniformity metrology
- Successful completion of a post-offer pre-employment background check
- Ability to travel less than 5%
- Must be a U.S. person within the meaning of ITAR (U.S. Citizen, U.S. Permanent Resident, Political Asylee, or Refugee)
Desired Qualifications
- Engineering degree (MS or PhD)
- broad knowledge in either Electrical Engineering, Material & Science or Chemistry
- hands-on mindset
- excellent communicator
- advanced degrees and experience in a development environment
- Processing experience in the areas of Chemical and Mechanical Polish, and post-polish wafer surface cleaning
- Processing experience with Cu plating
- Ability to work well with junior and senior level, to include Process Technicians and Engineers
- Must be able to work in a dynamic start-up environment
- Requirement for strong ownership/responsiveness in a manufacturing environment, good data analysis/statistics skills and good oral/written communication skills
- Flexibility to work hands-on in the cleanroom, operate the tool when needed, write and run CMP recipes, inspect wafers under the microscope, and perform basic characterization related to CMP processing with particles / defects metrology, roughness metrology, and thickness / uniformity metrology
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