Process Development Engineer, Backend Die Packaging

Backend Process Development Engineer role focused on die packaging and backend processes for cryogenic/extreme-temperature QPU environments. Responsible for defining and designing backend processes from concept to production readiness, driving process transfer to production, tool qualification and procurement, SAT/testing, cleanroom build-out collaboration, and hands-on process implementation and validation. Cross-functional collaboration with wafer fab, QPU designers, test teams, operations, and facilities; experience with solder reflow, microbump/flip-chip interconnects, UBMs, and cryogenic packaging; 3+ years cleanroom operator experience; advanced degree in Electrical Engineering or Applied Physics preferred. Opportunities include scaling die packaging production lines and contributing to equipment/tool integration, qualification, and process documentation.