Process and Equipment Tech
On-site · Kuala Lumpur, Kuala Lumpur, Malaysia
Job Summary
The roles involve setting up and maintaining plating lines per process specifications, including recipe setup, plating bath maintenance, and chemical addition based on lab analysis for Plating Process Technician. Responsibilities also include performing maintenance and changing over loader/unloader systems for Plating Equipment Technician. Required qualifications include a diploma in engineering related to the specific roles and prior experience in electroplating within the semiconductor assembly industry. NXP emphasizes a commitment to sustainability and inclusivity.
Required Qualifications
- Diploma in Engineering (Chemical, Mechanical) or related for Plating Process Technician
- Diploma in Engineering (Electric/ Electronic, Mechanical) or related for Plating Equipment Technician
- Previous experience in electroplating in semiconductor assembly
Desired Qualifications
- Experience in electroplating in semiconductor assembly
Additional Requirements
- Current NXP employees should not apply through this posting but via the internal career page.
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