Principal Power Module Engineer
On-site · Lincoln, England, United Kingdom
Job Summary
Design of power modules incorporating wide band gap semiconductors (GaN, SiC) to ensure high switching performance and compliance with application-related standards, including embedding power devices within multi-layered PCB stacks for high-power density modules. Analyse magnetics, thermal characteristics, and EMI profiles to optimise performance; design and layout of high/low power circuits with attention to commutation loop inductance, gate loop inductance, current sharing, and EMI minimisation. Perform circuit simulations and PDN analysis; develop module designs with system-level architecture in mind (capacitor integration, heat sink/coolant flow, gate drive boards, power busbars). Produce schematic documentation and oversee early prototype manufacture. Utilise 3D/2D CAD (SolidEdge) and PCB design (Altium); employ finite element (ANSYS Mechanical, Q3D) and circuit simulation (LTSpice, PLECS) tools to maximise static/dynamic performance. Align designs with Design for Manufacture principles from the outset. Take on project leadership from idea to prototype manufacture within a collaborative team to meet customer requirements. Ideal candidate will have degree-level education in electronics/EE or related subject, experience in power module and system-level design, and familiarity with power electronics inverters; Masters/PhD and chartership (IEEE, IOP) viewed favourably.
Required Qualifications
- Educated to degree level or higher in electronics, electrical or mechanical engineering related subject.
- Equivalent relevant industrial experience in power electronics module design, PCB design and layout, or power systems development and design.
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