Principal Power Module Design Engineer
On-siteTaipei, Taiwan, Taiwan
Job Summary
Design high-current, high-density power modules for CPU/GPU/xPU core power and AI server power delivery applications. Collaborate with package engineers and IC designers to develop advanced packaging solutions integrating ICs, inductors, and capacitors. Conduct PDN extraction to assess power path losses and switch-node ringing, while designing inductors per module and silicon pinmap. Build and run thermal models to ensure components remain below maximum operating temperatures, then work with the validation team to debug power modules and perform bench characterization for efficiency, thermal, and transient performance. Support design-for-manufacturing (DFM) and design-for-test (DFT) activities throughout the end-to-end electrical design process from architecture definition through module validation.
Required Qualifications
- BSEE or MSEE
- 5+ years of hands-on power electronics design experience
- Strong experience designing high-current, high-frequency DC-DC converters, especially multiphase buck architectures
- Deep understanding of power stage design and magnetics for high-current applications
- Hands-on experience in PCB layout for high-current-density and high-frequency applications
- Proficiency with design and simulation tools: PCB layout: Cadence/Altium Designer
- Proficiency with design and simulation tools: Circuit simulation: SIMPLIS / SIMetrix
- Proficiency with design and simulation tools: PDN extraction and magnetic design: Q3D / PowerSI / Maxwell
- Proficiency with design and simulation tools: Thermal simulation: Flotherm / Icepak
- Proven ability to debug complex power circuits through lab measurement and root-cause analysis
- Ability to collaborate effectively across IC design, packaging, reliability, and manufacturing teams
Desired Qualifications
- Direct experience designing power modules, VRMs, or highly integrated power solutions
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