Principal Plating Engineer
$130,000–$130,000 year
Hybrid · Tempe, Arizona, United States or Mesa, Arizona, United States
Job Summary
Lead complex electroplating process development for a forthcoming 300mm wafer plating system, including ownership of chemical metrology systems. Collaborate with cross-functional teams (device physics, deposition, etching, photolithography, electrical test) to ensure robust electroplating processes meeting precise physical and electrical requirements. Maintain plating equipment, increase uptime, respond to production issues, write procedures for safe equipment use, and supervise junior engineers and users. Emphasizes data-driven improvements (SPC, statistical analysis), process development/new processes, cost reduction, yields enhancements, and potential intellectual property generation. Customer service and effective communication with students, faculty, and professionals are integral. This DoD-funded role requires compliance with applicable US-person definitions.
Required Qualifications
- Bachelor's degree and seven (7) years of experience appropriate to the area of assignment/field; OR any equivalent combination of experience and/or training from which comparable knowledge, skills and abilities have been achieved
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