Principal Engineer, HIG-HBM Product System Engineering (Media Health Manufacturing)
On-site · Singapore, Singapore
Job Summary
Principal Engineer leads Micron's High Bandwidth Memory (HBM) Product Engineering within the Media Health Manufacturing team, driving a portfolio of next-generation HBM products with focus on Quality, Cost, Cycle Time and Scale. Responsibilities include optimizing test coverage across current and future HBM architectures, developing and validating products, supporting design verification using CAD tools and Verilog simulations, improving manufacturing test yields, reducing test time, and steering DFT strategies to enable cost and time efficiency. Mentorship and cross-functional collaboration with Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams are required to achieve strategic and tactical objectives. On-site in Singapore with travel to the US, Taiwan, and Japan. AI and data-driven approaches, problem solving, and leadership in a dynamic environment are valued.
Required Qualifications
- Bachelors or Masters in Electrical and Electronics Engineering or related field
- 8+ years of experience in the semiconductor industry
- Product Engineering experience preferred
- Strong leadership and technical skills with deep problem solving and root-cause analysis
- Knowledge of statistics and data analysis tools; scripting ability
- Excellent communication and presentation skills
- Proven ability to collaborate across cross-functional teams (Fab, HBM Design/Technology Development, System Development, Quality/Reliability)
- Willingness to work on-site in Singapore with international travel to the US, Taiwan, and Japan
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