Principal Engineer GaN Package Development

Lead development, optimization, and implementation of GaN packaging and assembly processes. Define package architectures aligned with performance, reliability, and cost targets. Collaborate cross-functionally (R&D, design, production, quality, purchasing) for seamless transfer to manufacturing. Specify, select, and qualify equipment, materials, and tooling. Develop and maintain process documentation, specifications, and engineering change records. Provide technical expertise to troubleshoot manufacturing issues and lead root cause analysis. Manage supplier qualification and support technology transfer for outsourced processes. Drive yield, quality, and continuous improvement using SPC and data-driven methodologies. This role requires a Bachelor’s or Master’s degree in Mechanical Engineering, Microelectronics, Materials Science, Physics, or related field, and strong experience in semiconductor backend R&D and manufacturing, including assembly and packaging. Familiarity with GaN packaging, device characteristics, and related manufacturing challenges is advantageous. Possess strong analytical skills, data interpretation, and Six Sigma proficiency, along with effective cross-functional communication. This is a senior, hands-on engineering role within Nexperia’s GaN packaging domain at the Catania site, focusing on advancing packaging technologies for high-performance power devices.