Precision Motion Control Expert (Beijing Based, Semiconductor, Relocation Provided)
On-site · Beijing, Beijing, China
Beijing, Beijing, ChinaOn-siteFull TimeSenior LevelMasters DegreeUnknown
Type
Full Time
Level
Senior Level
Education
Masters Degree
Company size
Unknown
Job Summary
Lead architecture/design of real-time motion-control systems for advanced semiconductor equipment, develop and maintain motion-controller software, enable nanometer-level positioning and synchronized multi-axis control, optimize vibration and dynamics, lead cross-disciplinary collaboration, and contribute to technology roadmaps for next-generation hybrid bonding platforms.
Required Qualifications
- Master's degree or above in Automation, Control Engineering, Mechatronics, Electrical Engineering, Mechanical Engineering, or a related discipline
- 10+ years of experience in motion control development within the semiconductor equipment industry
- Proven experience developing motion control systems for high-precision semiconductor manufacturing equipment (e.g., hybrid bonding, wafer bonding, advanced packaging, lithography, inspection, metrology)
- Strong expertise in real-time control system architecture and motion-control software development
- Knowledge of vibration theory, vibration testing methodologies, and dynamic system analysis
- Experience with servo motor control algorithms and closed-loop control optimization
- Experience with MATLAB/Simulink, ANSYS, ADAMS, or equivalent tools
- Excellent analytical and problem-solving skills
- Ability to collaborate across software, electrical, mechanical, and process engineering teams
- Strong leadership and subject-matter expertise in motion control technologies
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