Packaging Module Development Engineer

Packaging Module Development Engineer needed to advance packaging materials technology development for co-packaged optical semiconductor assemblies. Work across packaging assembly module teams, package architecture, integration, substrate, an optical component materials supply chain, and semiconductor vendors and assembly/test providers worldwide. Responsibilities include conducting fundamental studies to characterize materials, identify failure modes, understand structure-property-performance interactions, assess material feasibility for products, and recommend material technologies; develop and source materials formulations meeting technology, quality, availability, and cost targets; deepen understanding of Intel's assembly process and materials interactions and their impact on product performance; collaborate with Materials, equipment and process engineering to build material technologies on test vehicles and products; develop materials assembly processes/equipment and apply novel concepts to enable future packaging platform technologies; create new techniques, metrologies, tools, and quality screens to identify potential packaging quality and reliability issues early. Required traits include technical problem solving, strong presentation and communication, fast-learning, and effective cross-team collaboration.