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NXP SemiconductorsPosted 1 month ago

Packaging Development Engineer

On-siteKuala Lumpur, Kuala Lumpur, Malaysia

Full TimeSenior LevelBachelors DegreeEnterprise

Job Summary

Lead, plan, and execute projects related to process assembly development and validation. Design, execute, and analyze process-related experiments using software for statistical analysis. Solve process issues with creative problem-solving techniques and create process recipes for packaging development, qualifying and transferring them for high-volume production. Set up new specifications and procedures for production while initiating the sharing of lessons learned and best practices among manufacturing sites. Lead or participate in Task Force Teams to identify risks and actions for mitigation during manufacturing operations. Support process qualification activities and drive small projects with a commitment to meeting deadlines.

Required Qualifications

  • Minimum Bachelor's degree in Engineering or Sciences (or related field)
  • Good aptitude in statistical data analysis and problem solving skills
  • Must exhibit pro-activeness in leading process characterization work
  • Ability to take on new challenges and embrace changes
  • Basic knowledge of project planning and experience in driving small projects
  • Excellent communication and presentation skills
  • Must demonstrate good initiative, collaboration, and interpersonal skills working with cross functional teams
  • Must be committed to meet process / project deadlines and commitments

Desired Qualifications

  • Master or PhD holder

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