Package and PCB Layout Engineer
On-siteHaifa, Haifa, Israel
Job Summary
Design, develop, and optimize RF hardware including PCB and package layout for WLAN and Bluetooth applications. Define floorplans and physical designs for RF circuit architecture while ensuring compliance with design rules and manufacturing constraints. Provide ownership of PCB layout from component placement to final output, supporting manufacturing and assembly processes. Collaborate with cross-disciplinary teams to integrate silicon, package, and board-level designs for co-design optimization. Implement design rules for specific substrate technologies to ensure DRC and DFM requirements are met. Requires 6+ years of experience and proficiency in Cadence Allegro.
Required Qualifications
- Bachelor's or BS degree in Electrical Engineering, Mechanical Engineering, or a related field, or equivalent experience as per business and job requirements
- 6+ years of experience
- Proficiency in Cadence Allegro and experience with board layout, package layout, and package technology
- Strong knowledge of RF fundamentals, including electromagnetic theory, communication theory, and RF system analysis
- Experience with circuit simulation tools and debugging techniques
- Familiarity with physical design for debugging and signal/power integrity analysis
- Understanding of design rules, design for manufacturability (DFM), and design rule checks (DRC)
- Experience with RF physical design for wireless products, including Si-Package-Board co-design optimization
- Knowledge of mentor CAD tools, AutoCAD, and/or SolidWorks
- Demonstrated ability to solve complex problems and work collaboratively within cross-functional teams
- Strong communication skills to effectively engage with multiple stakeholders and project teams
- Experience in designing and optimizing circuits for wireless communication products to achieve the highest performance, quality, and cost efficiency
- On-site presence
Hiring someone like this?
Get your role in front of qualified candidates on Sorce.