Optoelectronic IC Package Design Director

Own and drive advanced package selection, new product BGA configuration, and package structure while managing development schedules. Lead package layout, SI/PI optimization, design verification, and tapeout for custom in-house photonic, analog, and digital ICs supporting next-generation optical modules. Coordinate with cross-functional groups on feasibility analysis and design trade-offs to optimize silicon floor plan, bump, and pin out. Simulate and optimize signal and power integrity and RF performance, interfacing with CMs and vendors for sourcing and future product development. This role is part of the xPO engineering team at Ciena, a global leader in high-speed connectivity.