Module Engineering - Day Shift 5 or 7
$85,200–$162,500 year
On-sitePhoenix, Arizona, United States
Job Summary
Design and develop assembly processes and equipment to advance Intel's foundry packaging roadmap, optimizing manufacturing efficiency for quality, reliability, and yield requirements. Define process specifications using Design of Experiments and data analysis, while establishing material standards for contract assemblers and vendors. Create reliability screening techniques and acceleration methods to detect packaging risks, and lead continuous improvement initiatives to enhance equipment and process performance. Serve as a technical resource for foundry packaging challenges, responding to customer requests and influencing design decisions based on failure mechanisms. Lead standardization across product qualification frameworks and engage with partner engineering teams to assess process maturity.
Required Qualifications
- US Citizenship
- Bachelor's degree with 1+ years of experience in one of the following fields: Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study
- Master's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study
- Associate degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study with 12+ years of experience in an engineering role
- 6+ months of experience with Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles
- On-site presence
Desired Qualifications
- Prior experience working in a technology or semiconductor manufacturing environment
- Experience in semiconductor packaging processes, including assembly, materials, or reliability engineering within a foundry context
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