Module Development Engineer
$133,800–$188,890 year
On-siteHillsboro, Oregon, United States
Job Summary
Develop and optimize advanced manufacturing processes, including material selection, parameter adjustments, and equipment metrology, while conducting feasibility studies to support innovative device architectures. Design modifications to operating equipment to improve efficiency and collaborate with suppliers to integrate enabling technology solutions into production. Perform process technology feasibility studies using theoretical simulations and practical engineering methods to drive cost-sensitive technology roadmaps. Stay informed on industry trends to align manufacturing processes with evolving semiconductor needs. This role involves working in a fast-paced, manufacturing-driven R&D environment within Intel's semiconductor manufacturing innovation teams in Hillsboro, Oregon.
Required Qualifications
- PhD in a STEM discipline such as Electrical Engineering, Materials Science, Applied Physics, Chemical Engineering, Chemistry, or a closely related field
- at least 6+ months relevant experience
- Fundamental knowledge of plasma physics, surface reactions, thin film processes, and semiconductor materials
- Experience with experimental design, data collection, and statistical analysis
- Ability to analyze process results and clearly document findings in technical reports and presentations
- Strong problem solving skills
- ability to work independently while collaborating in cross functional teams
- Effective written and verbal communication skills in a technical environment
- Willingness to work in a fab or lab environment and follow strict safety and contamination control protocols
Desired Qualifications
- PhD research focus specifically related to plasma etch, pattern transfer, or advanced logic/memory process integration
- Hands on experience with production or pilot line dry etch tools (e.g., Lam, Applied Materials, TEL, ASM, Hitachi)
- Knowledge of advanced node challenges such as high aspect ratio etching, CD control, etch selectivity, and damage mitigation
- Experience with Design of Experiments (DOE) and statistical process control (SPC)
- Familiarity with process integration, yield learning, or technology development methodologies
- Programming or scripting experience for data analysis or automation (e.g., Python, MATLAB, JMP, or similar tools)
- Exposure to foundry or industrial semiconductor Research and Development environments through internships, collaborations, or joint research programs
- Ability to manage multiple experiments or development tasks in a fast paced, manufacturing driven Research and Development setting
- Demonstrated interest in transitioning academic research into high volume manufacturing solutions
- Hands on research experience with dry etch-related topics (e.g., plasma etching, RIE, ICP, ALE) through academic research, dissertation work, or internships
- Working understanding of semiconductor manufacturing process flows and device structures
- Familiarity with common semiconductor characterization techniques (e.g., SEM, TEM, AFM, XPS, ellipsometry)
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