Mechanical Design Engineer (Electronics Packaging)
$80,000–$100,000 year
HybridBuffalo, New York, United States
Job Summary
Develop, qualify, and transition to market best-in-class aviation electronics flight hardware by designing and analyzing the structural and thermal performance of electronic systems. Participate in proposal development as a mechanical packaging expert, steering design philosophy in thermal, vibration, and environmental areas while advising on trade study risks. Create, review, and document design concepts, CAD models, ICDs, and assembly drawings to ensure compliance with engineering policies. Prepare data items for projects including thermal, vibration, mechanical tolerance, and stackup analyses while meeting cost, schedule, and technical requirements. Present or review findings in technical and program reviews.
Required Qualifications
- Bachelor's degree in Mechanical Engineering from an accredited institution
- Ability to access United States Export Controlled information
- Minimum 3+ years of experience in mechanical design and analysis of complex mechanical systems
- Experience performing deflection and vibration analysis on printed circuit cards (PCB)
- Knowledgeable in the application and interpretation of GD&T principles in ASME Y14.5
- Proficiency in Worst Case, RSS, and 6-Sigma tolerance analysis of mechanical parts
- Demonstrated proficiency in the creation and composition of engineering drawings according to applicable Industry standards using modern CAD drafting tools
- Familiarity with basic electrical engineering principles, and the application and use of electrical connectors and other interconnect products
- Experience interpreting customer requirements and familiarity with industry standards
- Have an understanding of tolerance stackup analysis
- Familiarity with solder fatigue analysis
Desired Qualifications
- Experience in the Aerospace industry
- Proficiency in the use of Siemens NX or other modern solid modelling tools for complex 3-D part and assembly modeling
- Proficiency in ANSYS Finite Element Analysis (FEA)
- Familiarity with ANSYS ICEPAK (CFD / thermal analysis)
- Familiarity with ANSYS Sherlock
- Capable of performing steady state and transient thermal analysis using FEA software such as ANSYS Workbench
- Have an understanding of shock and random vibration as it relates to electronic boxes and PCBs
- Experience designing and creating solid 3D models using CAD software (prefer UG UniGraphics experience)
- Electronics systems experience is a plus
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