Manufacturing Engineer - Bar Process
On-siteSugar Land, Texas, United States
Job Summary
Troubleshoot production issues affecting cleaving, bar stacking/unstacking, and dicing operations while performing daily calibration and preventive maintenance on equipment. Resolve work order problems to minimize downtime, monitor product quality, and investigate defects related to cleaving and dicing processes. Conduct root cause analysis on manufacturing issues, analyze production data, and implement corrective actions to improve yield, throughput, and process stability. Develop process recipes for new products, create SOPs, and train manufacturing technicians. Collaborate cross-functionally with Production, Quality, and IT teams, and work with vendors on new tool qualification and installation. This role supports the cleaving, bar stacking/unstacking, and dicing operations within our semiconductor manufacturing facility in Sugar Land, Texas.
Required Qualifications
- Master's degree in Materials Engineering, Mechanical Engineering, Manufacturing Engineering, Electrical Engineering, or related discipline
- Experience with semiconductor wafer processing, cleaving, dicing, or precision manufacturing
- Experience maintaining automated manufacturing equipment
- Knowledge of semiconductor manufacturing processes
- Strong troubleshooting and root cause analysis skills
- Experience using Excel for data analysis
- Ability to work in a cleanroom environment
- Strong ability in communication. Good at efficiently communicating with vendors on technical terms and negotiations
- Ability lift or move items weighing up to 20 pounds
- Must be currently authorized to work in the US
Desired Qualifications
- Familiarity with LabVIEW is a plus
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