Lead Photonics Packaging Engineer
$150,000–$300,000 year
Remote · Austin, Texas, United States or New York City, New York, United States
Austin, Texas, United States or New York City, New York, United StatesRemoteFull Time$150,000–$300,000 yearMid LevelBachelors DegreeUnknown
Type
Full Time
Level
Mid Level
Education
Bachelors Degree
Company size
Unknown
Job Summary
In this pivotal role, the Lead Photonics Packaging Engineer will drive packaging development for silicon photonics and optical modules, integrating photonics technologies into cutting-edge solutions. The ideal candidate will lead design efforts, oversee integration processes, and mentor junior engineers in a dynamic and innovative startup environment.
Required Qualifications
- Bachelor's or Master's degree in Electrical Engineering, Materials Science, or related field
- Minimum 5 years of experience in photonics packaging or semiconductor packaging
- Familiarity with photonics integration and related manufacturing processes
- Excellent problem-solving skills and ability to work collaboratively in a team environment
Desired Qualifications
- Strong knowledge of silicon photonics, packaging techniques, and optical module design
- Experience with flip-chip and wafer-level packaging technologies
- Experience leading and managing teams
Additional Requirements
- Must be currently authorized to work in the United States without the need for sponsorship for a non-immigrant visa
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